RT9199 PDF

The regulator is capable of actively sinking or sourcing up to 2A peak while regulating an output voltage to within 20mV. Other features include extremely low initial offset voltage, excellent load regulation, current limiting in bi-directions and on-chip thermal shut-down protection. Connect this pin to a well-decoupled supply voltage. To prevent the input rail from dropping during large load transient, a large, low ESR capacitor is recommended to use. The capacitor should be placed as close as possible to the VIN pin.

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The regulator is capable of actively sinking or sourcing up to 2A peak while regulating an output voltage to within 20mV. Other features include extremely low initial offset voltage, excellent load regulation, current limiting in bi-directions and on-chip thermal shut-down protection. Connect this pin to a well-decoupled supply voltage.

To prevent the input rail from dropping during large load transient, a large, low ESR capacitor is recommended to use. The capacitor should be placed as close as possible to the VIN pin. Two resistors dividing down the VIN voltage on the pin to create the regulated output voltage.

VOUT Regulator output. It is capable of sinking and sourcing current while regulating the output rail. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device.

These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied.

Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. Devices are ESD sensitive.

Handling precaution recommended. Note 3. The device is not guaranteed to function outside its operating conditions. Note 4. Note 5. Note 6. Regulation is measured at constant junction temperature by using a 5ms current pulse. Devices are tested for load regulation in the load range from 0A to 2A peak. Note 7. Temperature 3. Temperature 0. In addition, the capacitor CSS and voltage divider form the low-pass filter. There are two reasons doing this design; one is for output voltage soft-start while another is for noise immunity.

For thermal consideration, please refer to the relative sections. RDS ON vs. A low ESR capacitor larger than uF is recommended for the input capacitor. Use short and wide traces to minimize parasitic resistance and inductance. Inappropriate layout may result in large parasitic inductance and cause undesired oscillation between RT and the preceding power converter. Thermal Consideration RT regulators have internal thermal limiting circuitry designed to protect the device during overload conditions.

Every package has several thermal dissipation paths. The path 2 is the main path due to these materials thermal conductivity. We define the exposed pad is the case point of the path 2. However, the package design has been decided. The thermal resistance can be decreased by adding copper under the expose pad of SOP-8 package. Dog-Bone Layout www. Even further, increasing the copper area of pad to 70mm2 Figure Thermal Resistance vs. Tel: Fax: Email: marketing richtek.

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终端稳压器电路RT9199

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