SN74LS245N PDF

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Building Automation? Electronic Point of Sale? Factory Automation and Control? Test and Measurement 3 Description These octal bus transceivers are designed for asynchronous two-way communication between data buses.

The control-function implementation minimizes external timing requirements. The output-enable OE input can disable the device so that the buses are effectively isolated. On all other products, production processing does not necessarily include testing of all parameters. UNIT V 7.

A —? CL includes probe and jig capacitance. All diodes are 1N or equivalent. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.

Phase relationships between inputs and outputs have been chosen arbitrarily for these examples. The outputs are measured one at a time with one input transition per measurement.

Figure 2. Load Circuits and Voltage Waveforms Copyright? This standard logic function has a common pinout, direction select pin, and active-low output enable. When the outputs are disabled, the A and B sides of the device are effectively isolated.

Logic Diagram Positive Logic 9. All outputs can be put into high impedance mode through the OE pin. Schematics of Inputs and Outputs Copyright? Customers should validate and test their design implementation to confirm system functionality. It allows isolation from the bus when necessary, and increases drive strength on the bus. Take care to avoid bus contention because it can drive currents that would exceed maximum limits. The high drive creates fast edges into light loads, so routing and load conditions must be considered to prevent ringing.

Power Supply — Each device must maintain a supply voltage between 4. See Electrical Characteristics for details. Figure 6 shows a simplified simulation of a ribbon cable from a 5-V, MHz low-drive strength source. By adding a high-current drive transceiver before the cable, the signal strength can be significantly improved, and subsequently the cable can be longer.

Both signals are measured at the distant end of the ribbon cable. Input signal is not shown. Figure 6. Each VCC pin must have a good bypass capacitor to prevent power disturbance. For devices with a single supply, TI recommends a 0. F bypass capacitor. F bypass capacitors for each power pin. It is acceptable to parallel multiple bypass capacitors to reject different frequencies of noise.

Two bypass capacitors of value 0. F and 1? F are commonly used in parallel. For best results, install the bypass capacitor s as close to the power pin as possible.

In many applications, some channels of the SNx4LS are unused, and thus must be terminated properly. Because each transceiver channel pin can be either an input or an output, they must be treated as both when being terminated.

Ground or VCC whichever is more convenient can be used to terminate unused inputs; however, each unused channel should be terminated to the same logic level on both the A and B side.

For example, in Figure 7 unused channels 4, 5, 6, and 7 are terminated correctly with both sides connected to the same voltage, while channel 8 is terminated incorrectly with each side being tied to a different voltage.

The OE input is also unused in this example, and is terminated directly to ground to permanently enable all outputs. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. Linked contents are provided "AS IS" by the respective contributors.

TI E2E? Created to foster collaboration among engineers. At e2e. All other trademarks are the property of their respective owners.

The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

This glossary lists and explains terms, acronyms, and definitions. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document.

For browser-based versions of this data sheet, refer to the left-hand navigation. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

Samples may or may not be available. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.

Finish options are separated by a vertical ruled line. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Military: SN54LS? Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application 1-Sep Addendum-Page 3 www. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. This drawing is subject to change without notice.

This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0. This dimension does not include interlead flash. Interlead flash shall not exceed 0. Publication IPC may have alternate designs.

Solder mask tolerances between and around signal pads can vary based on board fabrication site. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC may have alternate design recommendations.

Board assembly site may have different recommendations for stencil design. Dimensions in parenthesis are for reference only. These resources are intended for skilled developers designing with TI products. You are solely responsible for 1 selecting the appropriate TI products for your application, 2 designing, validating and testing your application, and 3 ensuring your application meets applicable standards, and any other safety, security, or other requirements.

These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.

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